Professional Custom PCB Manufacturer & SMT Assembly Provider for Global Electronics
YC Electronic manufactures custom PCBs and provides SMT, THT and mixed PCBA services for overseas electronics projects. Send Gerber files, BOM, material, layer count, surface finish, quantity and test requirements for engineering review and quotation.
Rapid Prototyping
Prototype schedules are confirmed after Gerber, material, finish, quantity and testing requirements are reviewed. DFM and DFA feedback can be provided before production release.
One-Stop PCBA Services
Component sourcing, SMT, THT, BGA, mixed assembly, inspection and packing can be coordinated according to your BOM, assembly files and acceptance requirements.
Enterprise-Grade Quality
Quality and compliance requirements can be reviewed according to the order, including material documentation, AOI, X-Ray, electrical testing, ICT and FCT where applicable.
Why Leading Electronics Companies Choose YC PCB
YC PCB combines engineering review, PCB fabrication, assembly coordination and quality inspection to support prototype, pilot and repeat production orders.
Support covers rigid PCB, metal-core substrates, flexible circuits and PCB assembly according to project files.
Engineering, quality and production teams coordinate file review, manufacturing questions, inspection and shipment requirements.
Production capacity supports prototype, small-batch and volume orders after material and process feasibility are confirmed.
Order status, technical questions, inspection requirements and delivery arrangements are communicated throughout the project.
Complete PCB Manufacturing & Assembly Capabilities
YC PCB supports PCB fabrication, component sourcing, assembly and testing based on your manufacturing files and delivery requirements.
Advanced PCB Fabrication
- Single to 40-layer multilayer PCB customization
- FR4, aluminum, copper, rigid-flex and flexible materials
- HDI, high-speed, impedance control and gold finger plating
- HASL, ENIG, OSP and silver plating options
- CNC milling, V-cut and precision edge processing
Comprehensive PCBA Assembly
- SMT, through-hole, BGA, QFN and Micro-BGA assembly
- Mixed assembly combining SMD and through-hole components
- Component sourcing from trusted distributors
- IC programming and NDA protection available
- Full product assembly and OEM / ODM integration
Rigorous Quality & Testing
- Electrical testing for production orders
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Select the PCB route according to material, layer count, thermal load, bending requirement and assembly method. Submit the relevant files so engineering can confirm manufacturability, inspection scope and quotation.
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FR4 boards are available for LED lighting, industrial control, communication modules and general electronics where standard rigid-board performance meets the project requirements.
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Single-layer FR4 boards can be reviewed for LED strip lighting, including board length, reflective solder mask, copper weight, finish and panel separation.
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Industrial Control Series Double Layer FR4 PCB
Double-layer FR4 boards can be reviewed for industrial control and driver projects requiring plated holes, connector areas, power routing and repeat production.
Request DFM Review
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Gold finger FR4 boards are available for plug-in interfaces; confirm plating area, thickness, bevel, insertion requirement and connector drawing.
Discuss Gold Finger PCB
Communication Series 4 Layer FR4 PCB
Four-layer FR4 boards can be reviewed with ENIG, stack-up, ground and power layers, routing density, impedance notes and assembly requirements.
Get 4-Layer PCB QuoteMultilayer & HDI PCB for High-Density and High-Speed Electronics
Multilayer and HDI boards are available for telecom, server, data-center, automotive and industrial electronics after stack-up, via structure, material and impedance review.
OEM / ODM ENIG Multilayer PCB
ENIG multilayer boards can be quoted after layer count, stack-up, copper weight, pad finish, board thickness and assembly method are confirmed.
Get Multilayer Quote
HDI PCB FR4 20-Layer PCB
HDI projects require Gerber, drill data, stack-up, blind or buried via structure, BGA pitch, impedance notes and reliability requirements.
Review HDI Project
Gold Finger 16-Layer PCB
Gold finger multilayer boards can be reviewed for memory, motherboard and communication modules, including plating, bevel, connector fit and wear requirements.
Ask About Gold Finger
Impedance Control 8oz Copper 30-Layer PCB
Heavy-copper impedance boards require joint review of copper distribution, trace geometry, dielectric thickness, reference planes, current paths and test coupons.
Send Stack-Up Requirement
Edge Connector Gold-Plated PCB
Edge connector boards can be produced according to connector drawings, gold-plated contact requirements, bevel dimensions, board thickness and insertion conditions.
Get Edge PCB Quote
Immersion Gold PCB 32-Layer PCB
Thirty-two-layer immersion-gold boards require complete stack-up, material, copper, impedance, drilling, finish and testing specifications before quotation.
Discuss 32-Layer PCBAluminum PCB for LED Lighting and Thermal Management
Aluminum substrate boards are available for LED and power projects where heat must transfer from components through the dielectric layer to the metal base.
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High-bay aluminum PCBs can be reviewed according to LED wattage, thermal conductivity, aluminum thickness, copper weight, board outline and fixture contact.
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Two-layer aluminum routes require confirmation of circuit structure, dielectric insulation, thermal target, board thickness, drilling and assembly process.
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High-thermal aluminum PCBs are quoted according to the required W/m·K value, dielectric data, LED layout, copper weight, finish, insulation and heat-sink interface.
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Eight-watt thermal aluminum substrates require material datasheet confirmation, heat-load review, dielectric thickness, insulation target and fixture contact requirements.
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Copper substrate PCB routes are available for high-power lighting and power modules that require stronger heat spreading than standard aluminum or FR4 boards.
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Flashlight copper substrates can be reviewed according to LED package, board diameter, current, copper-base thickness, thermal interface and assembly requirements.
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Projector copper substrates require confirmation of LED power, heat concentration, board flatness, mounting method, surface finish and operating temperature.
Discuss Projector PCB
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Thermoelectric-separation copper substrates are reviewed according to the thermal pad structure, electrical isolation, copper base, component layout and mechanical drawing.
Review Copper Structure
Copper Substrate Board for Stage Lights
Stage-light copper substrates can be quoted after LED array, current path, thermal load, board shape, finish and fixture contact are confirmed.
Send Lighting ProjectPCB Assembly / PCBA for Turnkey Electronics Production
YC PCB can coordinate PCB fabrication, BOM review, component sourcing, SMT, THT, inspection, functional testing and packing under one PCBA order.
LED Tube Light SMT PCB
LED tube PCBA projects require PCB files, BOM, LED bin or CCT requirements, placement data, polarity, thermal target and functional test method.
Get SMT PCBA Quote
Yüksek Termal İletkenlikli Alüminyum Altlık-UFO
UFO high-bay boards require confirmation of LED wattage, thermal conductivity, board outline, mounting holes, surface finish, assembly and lighting test requirements.
Discuss UFO LED PCB
Automotive PCB Assembly with SMT Through-Hole DIP
Automotive PCBA projects can be reviewed for SMT and THT assembly, component sourcing, vibration-related design points, inspection, functional testing and packing.
Send Automotive PCBAFlexible & Rigid-Flex PCB for Compact and Dynamic Electronics
Flexible and rigid-flex projects require complete layer structure, PI material, stiffener, bend area, coverlay, impedance, assembly and dynamic-bending requirements.
Double Layer Flexible PCB
Double-layer flexible PCBs can be reviewed for thickness, copper, coverlay, stiffener, bend radius, connector area and repeated-flex requirements.
Get Flex PCB Quote
4 Katmanlı Esnek PCB Özel Esnek Devreler
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Review Flex Circuit
Çift Taraflı Hızlı Döndürmeli Sert Esnek PCB
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Discuss Rigid-Flex ProjectIndustries We Serve with Custom PCB Solutions
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Communications
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Explore Solutions
LED Aydınlatma
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Explore Solutions
Endüstriyel Kontrol
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Explore Solutions
Tıbbi Cihazlar
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Explore Solutions
Otomotiv Elektroniği
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Explore Solutions
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YC PCB supports HDI, impedance control, heavy copper and precision plating when the stack-up, material, geometry and acceptance requirements are provided.
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HDI enables compact BGA escape and dense routing. Submit blind-via, buried-via, microvia, via-in-pad and sequential-lamination requirements for manufacturability review.
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Controlled-impedance production requires target values, controlled layers, reference planes, trace width and spacing, material data, stack-up and TDR coupon requirements.
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Heavy copper is reviewed according to current load, copper distribution, minimum spacing, etching allowance, plating, thermal concentration and board thickness.
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Gold finger production requires contact length, plating thickness, nickel underlayer, bevel angle, selective-plating area and insertion-cycle requirements.
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YC PCB coordinates sourcing, fabrication, assembly, inspection and shipment according to the approved BOM, PCB files, assembly drawings and test plan.
Component Sourcing & Procurement
Submit the BOM with manufacturer part numbers, approved alternatives and sourcing restrictions so availability, lead time and substitution risks can be reviewed.
Confirmed after BOM availability and supplier lead-time review.
PCB Üretimi
Gerber, drill, stack-up, material, finish and panel requirements are reviewed before PCB production and assembly release.
Confirmed after PCB complexity, material, finish, quantity and testing review.
Assembly & Soldering
SMT, THT, BGA or mixed assembly is arranged according to placement files, assembly drawings, component packages and soldering requirements.
Confirmed after BOM, assembly complexity, quantity and inspection scope review.
Testing & Quality Verification
AOI, X-Ray, ICT, FCT and project-specific tests can be arranged according to component packages, coverage requirements and acceptance criteria.
Confirmed after the test method, fixture, programming and reporting requirements are reviewed.
Packaging & Shipment
Finished PCBAs are packed with suitable ESD and mechanical protection according to board size, components, labels and shipping method.
Confirmed according to destination, freight method, customs requirements and delivery target.
State-of-the-Art Manufacturing & Testing Equipment
Production and inspection equipment support material preparation, imaging, etching, lamination, drilling, routing, AOI and X-Ray processes.
Kesim Makinesi
Zımpara Makinesi
Pozlama Makinesi
Aşındırma Makinesi
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Lehim Maskesi
Silkscreen
Laminating
V-Cut
Drilling
X-Ray Inspection
Die Punching
Quality Assurance & Industry Certifications
Quality-system and compliance documents can be reviewed according to the PCB material, target market and order requirements.
ISO 9001 Sertifikası
Quality-management procedures cover document control, production inspection, nonconformance handling and continuous improvement.
RoHS Uygunluğu
RoHS-related material and process requirements can be reviewed when specified in the RFQ or purchase order.
National High-Tech Enterprise
Technical and enterprise qualification documents can be provided for review when relevant to supplier approval.
Dedicated Engineering Support for Every Project
Engineering support covers file questions, material and process selection, DFM/DFA feedback, production issues and inspection requirements.
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Submit Gerber files, drill data, stack-up, BOM, quantity, finish, testing and delivery requirements for a quotation based on the actual manufacturing route.
Send Your PCB / PCBA Requirements
Tell us what you need. For Gerber files, drill data, stack-up, BOM, pick-and-place files, assembly drawings or other attachments, email them directly to sales@ycelectronic.com after submitting this form.