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PCB FR4 a 4 Strati with ENIG
YC PCB supplies communication-series 4 layer FR4 PCBs with ENIG finish for network modules, industrial gateways and control interfaces. Production can include stack-up confirmation, custom copper weight, AOI, electrical testing and optional SMT/THT assembly based on your Gerber, drill, BOM and test files.
Communication PCB Details
Confirm the board outline, ENIG pad requirements, via and hole data, routing density, connector positions and assembly scope before placing the order.
Full Board View
Provide the finished board dimensions, mounting-hole tolerances, connector orientation and panel requirements for production confirmation.
ENIG Pad Detail
Specify component pitch, exposed-pad areas, storage period and soldering process so the ENIG finish can be matched to the assembly requirement.
Via & Routing Area
Supply complete drill data and identify signal-sensitive areas so via construction, routing clearance and ground-return paths can be checked before release.
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For assembled modules, include the BOM, centroid file, assembly drawing, approved substitutions and functional-test requirements with the PCB package.
4 Layer FR4 PCB Specs
The specifications below cover the principal purchasing items for this 4 layer FR4 PCB. Final material, thickness, copper weight, stack-up, finish and delivery schedule are confirmed from the manufacturing files and order quantity.
| Item | Specification / Review Content |
|---|---|
| Product Type | Communication Series 4 Layer FR4 PCB with ENIG |
| PCB Structure | Four-layer rigid FR4 circuit board with two outer signal layers and project-defined inner ground, power or signal layers |
| cURL Too many subrequests by single Worker invocation. To configure this limit, refer to https://developers.cloudflare.com/workers/wrangler/configuration/#limits | FR4 or high-Tg FR4 selected according to operating temperature, assembly process and reliability requirements |
| Surface Finish | ENIG for flat component pads, oxidation protection, solderability and storage before assembly |
| Maschera di Saldatura | Green, blue, black or white LPI solder mask according to the approved drawing and marking requirements |
| cURL Too many subrequests by single Worker invocation. To configure this limit, refer to https://developers.cloudflare.com/workers/wrangler/configuration/#limits | Common 1 oz or custom copper weight selected according to current, trace geometry and copper-balance requirements |
| cURL Too many subrequests by single Worker invocation. To configure this limit, refer to https://developers.cloudflare.com/workers/wrangler/configuration/#limits | Finished thickness confirmed from the mechanical drawing, connector geometry and approved stack-up |
| Stack-Up | Signal, ground, power and bottom-layer functions confirmed from Gerber data and electrical requirements |
| Routing Review | Signal return paths, via construction, copper balance, clearances, panelization and controlled-impedance notes |
| Edge Process | CNC routing, V-Cut, breakaway tabs and tooling selected according to board outline and assembly method |
| Testing Support | AOI, electrical continuity/isolation testing, dimensional inspection and final visual inspection |
| Assembly Support | SMT, THT and mixed assembly, including BGA/QFN processing and project-defined functional testing |
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ENIG provides a flat, oxidation-resistant solderable surface for fine-pitch SMT pads, connector pads and boards that may be stored before assembly.
4 Layer Stack-Up
The stack-up is defined from the Gerber files, finished thickness, copper weight and electrical requirements. Signal direction, ground reference, power distribution, via transitions and assembly constraints are considered together.
Engineering Review
Communication PCB Applications
This board route is suitable for communication products requiring moderate routing density, multiple connectors, stable SMT assembly and a cost-effective FR4 construction.
Network Modules
Suitable for router interfaces, network adapters and communication modules requiring internal ground or power layers.
Industrial Gateways
Suitable for gateway control boards combining communication interfaces, control ICs, connectors and local power circuits.
Signal Control Boards
Suitable for signal conversion, interface management and mixed digital-control circuitry.
Communication PCBA
Available as bare PCB or assembled PCBA with BOM sourcing, SMT/THT placement and project-defined testing.
Why ENIG Finish?
ENIG is a practical choice when the project requires flat component pads, reliable solderability, exposed contact areas or storage before assembly.
| Buyer Concern | How ENIG Helps | What to Confirm |
|---|---|---|
| Fine-Pitch SMT Pads | ENIG provides a flat solderable surface for fine-pitch and assembly-sensitive components. | Confirm pad dimensions, component package, stencil requirements and assembly process. |
| Storage Before Assembly | The nickel-gold surface protects exposed copper during normal storage and handling. | Confirm expected storage period, packaging method and solderability acceptance criteria. |
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Stack-Up
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Ground Return
Ground reference continuity and return paths should be maintained around communication signals, clock lines and interface circuits.
Via Design
Via diameter, finished hole size, annular ring, PTH/NPTH designation and drill tolerance directly affect manufacturability and reliability.
Connector Area
Connector pads, plated holes, insertion loads, edge clearance and mechanical alignment must match the mating hardware.
Impedance Review
For controlled-impedance traces, provide target values, controlled layers, reference planes, trace geometry and tolerance requirements.
BGA / QFN
For BGA and QFN packages, provide the package data, land pattern, thermal-pad requirements, inspection criteria and rework restrictions.
Test Points
Include ICT, FCT, programming or maintenance access requirements before panelization and fixture planning.
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Specify CNC routing, V-Cut, tooling holes, fiducials, breakaway tabs and packing requirements for repeat production.
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Production proceeds from file verification and material preparation through inner-layer processing, lamination, drilling, plating, ENIG finishing, inspection and packing.
File and Stack-Up Review
Gerber, drill data, layer order, board thickness, copper weight, ENIG specification and panel requirements are verified before production tooling.
FR4 Material Preparation
FR4 laminate, prepreg and copper foil are selected according to the approved stack-up and finished thickness.
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Inner-layer circuits are imaged, etched and inspected before the layers are prepared for lamination.
Lamination and Drilling
The multilayer structure is laminated before vias, plated through holes and mechanical holes are drilled to the approved data.
Outer Layer Imaging and Plating
Outer-layer circuits are formed and plated through holes create electrical connections between the four copper layers.
Solder Mask, Silkscreen and ENIG
LPI solder mask, legend and ENIG finish are applied according to the approved color, pad and marking requirements.
Routing, Testing and Packing
Finished boards undergo routing, dimensional inspection, AOI, electrical testing, quantity verification and protective packing before dispatch.
What Buyers Should Confirm
Pre-Shipment Checks
Pre-shipment inspection covers laminate and stack-up consistency, layer registration, plated-hole continuity, ENIG pad condition, circuit integrity, dimensions and packing.
Material Check
FR4 laminate, prepreg, copper foil and process materials are matched to the approved order specification.
Layer Registration
Inner and outer layers are checked for registration, drill alignment and finished-hole conformity during production.
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Test Elettrico
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Assembly Support
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BGA / QFN Review
BGA and QFN assembly can include stencil review, placement control, X-Ray inspection and agreed rework criteria.
THT Components
THT assembly supports connectors, terminal blocks, pin headers and other through-hole components.
Functional Test
Testing can include ICT, FCT, programming and custom fixtures according to the product test specification.
4 Layer vs Other Routes
Choose the board structure according to routing density, signal performance, component pitch, connector count, assembly method and budget. Four-layer FR4 with ENIG is suitable when internal planes and flat solderable pads are required without moving to HDI or special RF materials.
| PCB Route | Better For | cURL Too many subrequests by single Worker invocation. To configure this limit, refer to https://developers.cloudflare.com/workers/wrangler/configuration/#limits |
|---|---|---|
| 4 Layer FR4 PCB with ENIG | Communication modules, gateways, control interfaces, SMT pads and medium routing density. | Choose when FR4 material, 4 layer routing and ENIG finish match the electrical and assembly needs. |
| PCB a 2 Strati FR4 | Cost-controlled control boards, driver boards and less dense routing. | Choose when the circuit is simple and routing density does not require internal planes. |
| PCB HDI | Very dense communication modules, microvias or compact fine-pitch layouts. | Choose when standard 4 layer routing cannot fit the design. |
| PCB ad alta frequenza | RF, microwave or signal-sensitive designs where FR4 loss may not be suitable. | Choose when the electrical requirement needs special high-frequency material. |
| cURL Too many subrequests by single Worker invocation. To configure this limit, refer to https://developers.cloudflare.com/workers/wrangler/configuration/#limits | Complete communication modules that require assembly and testing. | Choose when PCB fabrication, BOM, SMT/THT and test route should be quoted together. |
Common Project Routes
The examples below show common supply configurations for communication projects. Pricing and lead time are based on the submitted files, quantity, material, finish, assembly scope and testing requirements.
Gateway Control Board
Four-layer FR4 with ENIG for gateway interfaces, with connectors, ground reference, SMT pads and electrical testing defined in the order.
Network Module PCB
Four-layer FR4 for network-module routing, with layer order, via design, signal routing and panelization confirmed before production.
Communication PCBA
PCB fabrication plus SMT assembly for communication control modules, including BOM review, BGA/QFN inspection requirements and functional testing.
Send These Details
A complete RFQ allows material, stack-up, ENIG finish, testing, price and lead time to be confirmed without repeated technical clarification.
What Helps the Quote
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What is a communication series 4 layer FR4 PCB with ENIG?
It is a four-layer rigid FR4 circuit board with ENIG finish, intended for communication modules, network electronics, industrial gateways and control interfaces that require internal ground/power planning and reliable SMT pads.
When should I choose 4 layer FR4 instead of 2 layer FR4?
Choose four layers when the design needs greater routing density, dedicated ground or power planes, more stable return paths or a compact layout that cannot be routed reliably on two layers.
Why is ENIG used on this FR4 PCB?
ENIG provides flat component pads, good solderability and protection against surface oxidation, making it suitable for fine-pitch components and boards stored before assembly.
Can YC PCB review impedance requirements?
Yes. Provide the target impedance, controlled layers, reference planes, trace width and spacing, tolerance and stack-up requirements with the Gerber files.
Is FR4 suitable for all communication PCBs?
FR4 is suitable for many control and interface boards. RF, microwave and higher-speed low-loss applications may require a different laminate or a specially controlled stack-up.
Can this board be assembled by YC PCB?
Yes. SMT, THT and mixed assembly can be quoted with component sourcing, inspection and testing when complete BOM and assembly files are supplied.
Can you support BGA or QFN assembly on this 4 layer board?
Yes. BGA, QFN and fine-pitch packages can be assessed from the land pattern, package data, stencil requirements, X-Ray criteria and test plan.
What files are needed for quotation?
Send Gerber RS-274X, Excellon drill data, stack-up requirements, finished thickness, copper weight, solder-mask color, ENIG specification, quantity and requested delivery date. Add BOM and assembly files for PCBA.
How is the stack-up confirmed?
The final stack-up is confirmed from the Gerber files, finished thickness, copper weight, electrical requirements, controlled-impedance notes and available laminate construction.
What tests are available before shipment?
Available checks include AOI, electrical continuity/isolation testing, ENIG surface inspection, dimensional inspection, final visual inspection and packing verification.
Can I order prototypes or small batches?
Yes. Prototype, small-batch and repeat-production orders are supported. Material availability, process complexity and quantity determine the confirmed lead time.
Can you provide PCBA testing support?
ICT, FCT, programming and custom fixture support can be quoted from the test specification, BOM and assembled product requirements.
What is the difference between this page and the FR4 PCB category page?
The category page covers the wider FR4 PCB range; this product route is specifically for four-layer communication boards using ENIG finish, internal-layer planning and optional assembly.
Send Your 4 Layer FR4 PCB Files
Send Gerber and drill files, stack-up requirements, finished thickness, copper weight, ENIG specification, quantity and assembly files when required. YC PCB will confirm manufacturability, production scope, price and delivery schedule from the submitted data.
Send Your 4 Layer FR4 PCB Requirements
Tell us what you need. For Gerber files, drill data, stack-up notes, impedance requirements, BOM, assembly drawings or other attachments, email them directly to sales@ycelectronic.com after submitting this form.
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