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Professional Custom PCB Manufacturer & SMT Assembly Provider for Global Electronics

YC Electronic manufactures custom PCBs and provides SMT, THT and mixed PCBA services for overseas electronics projects. Send Gerber files, BOM, material, layer count, surface finish, quantity and test requirements for engineering review and quotation.

VALUE POINT 1

Rapid Prototyping

Prototype schedules are confirmed after Gerber, material, finish, quantity and testing requirements are reviewed. DFM and DFA feedback can be provided before production release.

VALUE POINT 2

One-Stop PCBA Services

Component sourcing, SMT, THT, BGA, mixed assembly, inspection and packing can be coordinated according to your BOM, assembly files and acceptance requirements.

VALUE POINT 3

Enterprise-Grade Quality

Quality and compliance requirements can be reviewed according to the order, including material documentation, AOI, X-Ray, electrical testing, ICT and FCT where applicable.

OUR STRENGTH

Why Leading Electronics Companies Choose YC PCB

YC PCB combines engineering review, PCB fabrication, assembly coordination and quality inspection to support prototype, pilot and repeat production orders.

20+
Years Industry Experience

Support covers rigid PCB, metal-core substrates, flexible circuits and PCB assembly according to project files.

300+
Professional Experts

Engineering, quality and production teams coordinate file review, manufacturing questions, inspection and shipment requirements.

100K+
m² Monthly Capacity

Production capacity supports prototype, small-batch and volume orders after material and process feasibility are confirmed.

99%
Customer Satisfaction

Order status, technical questions, inspection requirements and delivery arrangements are communicated throughout the project.

COMPLETE SOLUTIONS

Complete PCB Manufacturing & Assembly Capabilities

YC PCB supports PCB fabrication, component sourcing, assembly and testing based on your manufacturing files and delivery requirements.

Advanced PCB Fabrication

  • Single to 40-layer multilayer PCB customization
  • FR4, aluminum, copper, rigid-flex and flexible materials
  • HDI, high-speed, impedance control and gold finger plating
  • HASL, ENIG, OSP and silver plating options
  • CNC milling, V-cut and precision edge processing

Comprehensive PCBA Assembly

  • SMT, through-hole, BGA, QFN and Micro-BGA assembly
  • Mixed assembly combining SMD and through-hole components
  • Component sourcing from trusted distributors
  • IC programming and NDA protection available
  • Full product assembly and OEM / ODM integration

Rigorous Quality & Testing

  • Electrical testing for production orders
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Select the PCB route according to material, layer count, thermal load, bending requirement and assembly method. Submit the relevant files so engineering can confirm manufacturability, inspection scope and quotation.

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FR4 boards are available for LED lighting, industrial control, communication modules and general electronics where standard rigid-board performance meets the project requirements.

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Single-layer FR4 boards can be reviewed for LED strip lighting, including board length, reflective solder mask, copper weight, finish and panel separation.

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Industrial Control Series Double Layer FR4 PCB
Double Layer FR4

Industrial Control Series Double Layer FR4 PCB

Double-layer FR4 boards can be reviewed for industrial control and driver projects requiring plated holes, connector areas, power routing and repeat production.

Request DFM Review
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Gold Finger FR4

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Gold finger FR4 boards are available for plug-in interfaces; confirm plating area, thickness, bevel, insertion requirement and connector drawing.

Discuss Gold Finger PCB
Communication Series 4 Layer FR4 PCB
4 Layer FR4 ENIG

Communication Series 4 Layer FR4 PCB

Four-layer FR4 boards can be reviewed with ENIG, stack-up, ground and power layers, routing density, impedance notes and assembly requirements.

Get 4-Layer PCB Quote

Multilayer & HDI PCB for High-Density and High-Speed Electronics

Multilayer and HDI boards are available for telecom, server, data-center, automotive and industrial electronics after stack-up, via structure, material and impedance review.

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ENIG Multilayer

OEM / ODM ENIG Multilayer PCB

ENIG multilayer boards can be quoted after layer count, stack-up, copper weight, pad finish, board thickness and assembly method are confirmed.

Get Multilayer Quote
HDI PCB FR4 20 Layer PCB
20 Layer HDI

HDI PCB FR4 20-Layer PCB

HDI projects require Gerber, drill data, stack-up, blind or buried via structure, BGA pitch, impedance notes and reliability requirements.

Review HDI Project
Gold Finger 16 Layer PCB
16 Layer Gold Finger

Gold Finger 16-Layer PCB

Gold finger multilayer boards can be reviewed for memory, motherboard and communication modules, including plating, bevel, connector fit and wear requirements.

Ask About Gold Finger
Impedance Control 8oz Copper 30 Layer PCB
30 Layer / 8oz

Impedance Control 8oz Copper 30-Layer PCB

Heavy-copper impedance boards require joint review of copper distribution, trace geometry, dielectric thickness, reference planes, current paths and test coupons.

Send Stack-Up Requirement
Edge Connector Gold Plated PCB
Edge Connector

Edge Connector Gold-Plated PCB

Edge connector boards can be produced according to connector drawings, gold-plated contact requirements, bevel dimensions, board thickness and insertion conditions.

Get Edge PCB Quote
Immersion Gold 32 Layer PCB
32 Layer Immersion Gold

Immersion Gold PCB 32-Layer PCB

Thirty-two-layer immersion-gold boards require complete stack-up, material, copper, impedance, drilling, finish and testing specifications before quotation.

Discuss 32-Layer PCB

Aluminum PCB for LED Lighting and Thermal Management

Aluminum substrate boards are available for LED and power projects where heat must transfer from components through the dielectric layer to the metal base.

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High-bay aluminum PCBs can be reviewed according to LED wattage, thermal conductivity, aluminum thickness, copper weight, board outline and fixture contact.

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Single Side With Two Layer Aluminum PCB
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Two-layer aluminum routes require confirmation of circuit structure, dielectric insulation, thermal target, board thickness, drilling and assembly process.

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High-thermal aluminum PCBs are quoted according to the required W/m·K value, dielectric data, LED layout, copper weight, finish, insulation and heat-sink interface.

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Eight-watt thermal aluminum substrates require material datasheet confirmation, heat-load review, dielectric thickness, insulation target and fixture contact requirements.

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Copper substrate PCB routes are available for high-power lighting and power modules that require stronger heat spreading than standard aluminum or FR4 boards.

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Flashlight copper substrates can be reviewed according to LED package, board diameter, current, copper-base thickness, thermal interface and assembly requirements.

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Projector Lighting

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Projector copper substrates require confirmation of LED power, heat concentration, board flatness, mounting method, surface finish and operating temperature.

Discuss Projector PCB
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Thermoelectric Separation

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Thermoelectric-separation copper substrates are reviewed according to the thermal pad structure, electrical isolation, copper base, component layout and mechanical drawing.

Review Copper Structure
Copper Substrate Board for Stage Lights
Stage Lighting

Copper Substrate Board for Stage Lights

Stage-light copper substrates can be quoted after LED array, current path, thermal load, board shape, finish and fixture contact are confirmed.

Send Lighting Project

PCB Assembly / PCBA for Turnkey Electronics Production

YC PCB can coordinate PCB fabrication, BOM review, component sourcing, SMT, THT, inspection, functional testing and packing under one PCBA order.

LED Tube Light SMT PCB
SMT LED PCBA

LED Tube Light SMT PCB

LED tube PCBA projects require PCB files, BOM, LED bin or CCT requirements, placement data, polarity, thermal target and functional test method.

Get SMT PCBA Quote
High Thermal Conductivity Aluminum Substrate UFO
UFO High Bay Light

Substrat en aluminium à haute conductivité thermique - UFO

UFO high-bay boards require confirmation of LED wattage, thermal conductivity, board outline, mounting holes, surface finish, assembly and lighting test requirements.

Discuss UFO LED PCB
Automotive PCB Assembly SMT DIP
SMT + DIP

Automotive PCB Assembly with SMT Through-Hole DIP

Automotive PCBA projects can be reviewed for SMT and THT assembly, component sourcing, vibration-related design points, inspection, functional testing and packing.

Send Automotive PCBA

Flexible & Rigid-Flex PCB for Compact and Dynamic Electronics

Flexible and rigid-flex projects require complete layer structure, PI material, stiffener, bend area, coverlay, impedance, assembly and dynamic-bending requirements.

Double Layer Flexible PCB
Double Layer FPC

Double Layer Flexible PCB

Double-layer flexible PCBs can be reviewed for thickness, copper, coverlay, stiffener, bend radius, connector area and repeated-flex requirements.

Get Flex PCB Quote
4 Layer Flex PCB Custom Flex Circuits
4 Layer Flex

Circuits flexibles personnalisés à 4 couches

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Review Flex Circuit
Flex rigidité double face à livraison rapide
Circuit imprimé rigide-flex

Flex rigidité double face à livraison rapide

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Discuss Rigid-Flex Project
INDUSTRIES WE SERVE

Industries We Serve with Custom PCB Solutions

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Communications industry PCB for telecom equipment

Communications

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Explore Solutions
LED Lighting industry high thermal conductivity PCB

Éclairage LED

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Explore Solutions
Industrial control PCB for automation

Contrôle Industriel

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Explore Solutions
Medical device PCB with reliability certification

Dispositifs médicaux

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Explore Solutions
Automotive electronics PCB assembly

Électronique automobile

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Explore Solutions
Data center server PCB high performance

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Explore Solutions
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YC PCB supports HDI, impedance control, heavy copper and precision plating when the stack-up, material, geometry and acceptance requirements are provided.

HDI High-Density Interconnect technology equipment

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HDI enables compact BGA escape and dense routing. Submit blind-via, buried-via, microvia, via-in-pad and sequential-lamination requirements for manufacturability review.

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High-Speed Impedance Control PCB design verification

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Controlled-impedance production requires target values, controlled layers, reference planes, trace width and spacing, material data, stack-up and TDR coupon requirements.

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Thick Copper electroplating process for high-current

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Heavy copper is reviewed according to current load, copper distribution, minimum spacing, etching allowance, plating, thermal concentration and board thickness.

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Gold Finger and precision plating edge connector

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Gold finger production requires contact length, plating thickness, nickel underlayer, bevel angle, selective-plating area and insertion-cycle requirements.

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YC PCB coordinates sourcing, fabrication, assembly, inspection and shipment according to the approved BOM, PCB files, assembly drawings and test plan.

Component sourcing and parts management workflow

Component Sourcing & Procurement

Submit the BOM with manufacturer part numbers, approved alternatives and sourcing restrictions so availability, lead time and substitution risks can be reviewed.

Confirmed after BOM availability and supplier lead-time review.

Fabrication de PCB

Gerber, drill, stack-up, material, finish and panel requirements are reviewed before PCB production and assembly release.

Confirmed after PCB complexity, material, finish, quantity and testing review.

Assembly & Soldering

SMT, THT, BGA or mixed assembly is arranged according to placement files, assembly drawings, component packages and soldering requirements.

Confirmed after BOM, assembly complexity, quantity and inspection scope review.

Testing & Quality Verification

AOI, X-Ray, ICT, FCT and project-specific tests can be arranged according to component packages, coverage requirements and acceptance criteria.

Confirmed after the test method, fixture, programming and reporting requirements are reviewed.

Packaging & Shipment

Finished PCBAs are packed with suitable ESD and mechanical protection according to board size, components, labels and shipping method.

Confirmed according to destination, freight method, customs requirements and delivery target.

STATE-OF-THE-ART

State-of-the-Art Manufacturing & Testing Equipment

Production and inspection equipment support material preparation, imaging, etching, lamination, drilling, routing, AOI and X-Ray processes.

Machine de coupe

Machine de coupe

Machine de meulage

Machine de meulage

Machine d'Exposition

Machine d'Exposition

Machine de Gravure

Machine de Gravure

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Masque de Soudure

Masque de Soudure

Silkscreen

Silkscreen

Machine de Laminage

Laminating

Machine V-Cut

V-Cut

Machine de Perçage

Drilling

X-Ray Inspection

X-Ray Inspection

Machine de Punching de Moule

Die Punching

QUALITY ASSURANCE

Quality Assurance & Industry Certifications

Quality-system and compliance documents can be reviewed according to the PCB material, target market and order requirements.

IPC Industry Standards Certification

Certification ISO 9001

Quality-management procedures cover document control, production inspection, nonconformance handling and continuous improvement.

RoHS Compliance Certificate

Conformité RoHS

RoHS-related material and process requirements can be reviewed when specified in the RFQ or purchase order.

UL Industry Recognition

National High-Tech Enterprise

Technical and enterprise qualification documents can be provided for review when relevant to supplier approval.

EXPERT TEAM

Dedicated Engineering Support for Every Project

Engineering support covers file questions, material and process selection, DFM/DFA feedback, production issues and inspection requirements.

24/7 Engineer Support

  • Technical assistance for design questions and production updates
  • Dedicated engineer assigned for consistent communication
  • Quick response for urgent project issues
  • Guidance on design optimization and cost reduction
Schedule Consultation →

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Submit Gerber files, drill data, stack-up, BOM, quantity, finish, testing and delivery requirements for a quotation based on the actual manufacturing route.

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