{"id":4148,"date":"2026-08-05T07:56:56","date_gmt":"2026-08-05T07:56:56","guid":{"rendered":"https:\/\/ycpcbs.com\/?page_id=4148"},"modified":"2026-08-10T02:21:30","modified_gmt":"2026-08-10T02:21:30","slug":"server-data-center-pcb-solutions","status":"publish","type":"page","link":"https:\/\/ycpcbs.com\/it\/server-data-center-pcb-solutions\/","title":{"rendered":"Server Data Center PCB Solutions"},"content":{"rendered":"<style>\n:root {\n  --primary:#34C759;\n  --primary-dark:#28a745;\n  --primary-light:#eaf9ee;\n  --ink:#0f172a;\n  --muted:#475569;\n  --soft:#f8fafc;\n  --line:#dbe5ee;\n  --dark:#03190f;\n  --white:#ffffff;\n  --green-text:#052e16;\n  --radius:28px;\n  --shadow:0 24px 70px rgba(15,23,42,.12);\n}\n\n* {\n  box-sizing:border-box;\n}\n\nhtml {\n  scroll-behavior:smooth;\n}\n\nbody {\n  margin:0;\n  background:#fff;\n  color:var(--ink);\n  font-family:'Inter',sans-serif;\n}\n\n.yc-server {\n  overflow:hidden;\n  background:#fff;\n}\n\n.yc-server a {\n  color:inherit;\n  text-decoration:none;\n}\n\n.section {\n  padding:92px 20px;\n}\n\n.section.tight {\n  padding:64px 20px;\n}\n\n.section.light {\n  background:#f8fafc;\n}\n\n.section.green-soft {\n  background:linear-gradient(180deg,#f0fdf4,#fff);\n}\n\n.section.dark {\n  background:\n    radial-gradient(\n      circle at top left,\n      rgba(52,199,89,.22),\n      transparent 36%\n    ),\n    linear-gradient(\n      135deg,\n      #07131f,\n      #042114 65%,\n      #05130e\n    );\n  color:#f8fafc;\n}\n\n.container {\n  width:min(1180px,100%);\n  margin:0 auto;\n}\n\nh1,\nh2,\nh3,\n.eyebrow,\n.btn,\n.stat-num,\n.toc-title {\n  font-family:'Lexend',sans-serif;\n}\n\nh1 {\n  font-size:clamp(42px,5vw,68px);\n  line-height:1.05;\n  letter-spacing:-.025em;\n  margin:0 0 22px;\n  color:#0f172a;\n}\n\nh2 {\n  font-size:clamp(30px,3.2vw,46px);\n  line-height:1.12;\n  letter-spacing:-.02em;\n  margin:0;\n  color:var(--ink);\n}\n\nh3 {\n  font-size:21px;\n  line-height:1.25;\n  letter-spacing:-.012em;\n  margin:0;\n  color:var(--ink);\n}\n\np {\n  font-size:16px;\n  line-height:1.75;\n  color:var(--muted);\n  margin:0;\n}\n\n.lead {\n  font-size:18px;\n  line-height:1.78;\n  color:#475569;\n  max-width:760px;\n  margin-top:18px;\n}\n\n.section.dark h2,\n.section.dark .section-head h2 {\n  color:#f8fafc!important;\n}\n\n.section.dark .lead,\n.section.dark .section-head .lead {\n  color:#d1fae5!important;\n}\n\n.eyebrow {\n  display:inline-flex;\n  align-items:center;\n  gap:9px;\n  padding:8px 14px;\n  border-radius:999px;\n  background:#eaf9ee;\n  color:#137333;\n  font-size:13px;\n  font-weight:800;\n  margin-bottom:18px;\n  box-shadow:inset 0 0 0 1px rgba(52,199,89,.18);\n}\n\n.section.dark .eyebrow {\n  background:rgba(52,199,89,.12);\n  color:#bbf7d0;\n  border:1px solid rgba(187,247,208,.35);\n  box-shadow:none;\n}\n\n.dot {\n  width:10px;\n  height:10px;\n  border-radius:50%;\n  background:var(--primary);\n  box-shadow:0 0 0 6px rgba(52,199,89,.18);\n}\n\n\/* Hero *\/\n\n.hero {\n  padding:86px 20px 92px;\n  background:\n    radial-gradient(\n      circle at 18% 0%,\n      rgba(52,199,89,.18),\n      transparent 35%\n    ),\n    linear-gradient(\n      180deg,\n      #ffffff,\n      #f0fdf4 58%,\n      #ffffff\n    );\n}\n\n.hero-grid {\n  display:grid;\n  grid-template-columns:1.02fr .98fr;\n  gap:54px;\n  align-items:center;\n}\n\n.hero p {\n  color:#475569;\n  font-size:18px;\n  line-height:1.8;\n  max-width:720px;\n}\n\n.hero-kws {\n  display:flex;\n  flex-wrap:wrap;\n  gap:10px;\n  margin:26px 0 34px;\n}\n\n.hero-kws span {\n  display:inline-flex;\n  padding:9px 12px;\n  border:1px solid rgba(52,199,89,.28);\n  background:#fff;\n  color:#166534;\n  border-radius:999px;\n  font-size:13px;\n  font-weight:800;\n  box-shadow:0 8px 20px rgba(15,23,42,.04);\n}\n\n.actions {\n  display:flex;\n  flex-wrap:wrap;\n  gap:14px;\n  margin-top:28px;\n}\n\n.btn {\n  display:inline-flex;\n  align-items:center;\n  justify-content:center;\n  gap:10px;\n  min-height:56px;\n  padding:0 24px;\n  border-radius:999px;\n  font-weight:800;\n  font-size:15px;\n  border:1px solid transparent;\n  transition:.2s ease;\n}\n\n.btn.primary {\n  background:var(--primary);\n  color:#052e16!important;\n  box-shadow:0 16px 34px rgba(52,199,89,.28);\n}\n\n.btn.primary:hover {\n  background:#2eb94f;\n  transform:translateY(-2px);\n}\n\n.btn.secondary {\n  background:#fff;\n  color:#0f172a!important;\n  border-color:#e2e8f0;\n}\n\n.btn.secondary:hover {\n  transform:translateY(-2px);\n  box-shadow:0 14px 30px rgba(15,23,42,.12);\n}\n\n.btn.dark {\n  background:#020617;\n  color:#fff!important;\n}\n\n.hero-card,\n.visual-card,\n.form-card {\n  background:#fff;\n  border:1px solid var(--line);\n  border-radius:var(--radius);\n  box-shadow:var(--shadow);\n  overflow:hidden;\n}\n\n.hero-card {\n  padding:18px;\n}\n\n.image-frame {\n  position:relative;\n  background:linear-gradient(180deg,#ffffff,#f8fafc);\n  border-radius:24px;\n  overflow:hidden;\n  border:1px solid #e2e8f0;\n}\n\n.image-frame img {\n  display:block;\n  width:100%;\n  height:100%;\n  object-fit:contain;\n  object-position:center;\n  background:#fff;\n  transition:transform .25s ease;\n}\n\n.hero-card .image-frame {\n  height:382px;\n}\n\n.hero-card .image-frame img,\n.wide-feature .image-frame img,\n.final-card .image-frame img {\n  object-fit:contain;\n  padding:10px;\n}\n\n.product-card .image-frame img,\n.visual-card .image-frame img {\n  object-fit:contain;\n  padding:8px;\n}\n\n.product-card:hover .image-frame img,\n.visual-card:hover .image-frame img {\n  transform:scale(1.025);\n}\n\n.hero-caption {\n  display:grid;\n  grid-template-columns:repeat(3,1fr);\n  gap:12px;\n  margin-top:16px;\n}\n\n.mini {\n  padding:16px;\n  border-radius:18px;\n  background:#f8fafc;\n  border:1px solid #e2e8f0;\n}\n\n.mini strong {\n  display:block;\n  font-family:'Lexend',sans-serif;\n  color:#0f172a;\n  font-size:16px;\n  margin-bottom:6px;\n}\n\n.mini span {\n  font-size:13px;\n  color:#64748b;\n  line-height:1.5;\n}\n\n\/* Statistics and page guide *\/\n\n.stats {\n  display:grid;\n  grid-template-columns:repeat(4,1fr);\n  gap:16px;\n  margin-top:32px;\n}\n\n.stat {\n  padding:24px;\n  border-radius:24px;\n  background:#fff;\n  border:1px solid #e2e8f0;\n  box-shadow:0 14px 36px rgba(15,23,42,.06);\n}\n\n.stat-num {\n  font-size:30px;\n  font-weight:800;\n  color:#0f172a;\n  margin-bottom:4px;\n}\n\n.stat p {\n  font-size:14px;\n  line-height:1.5;\n  color:#64748b;\n}\n\n.toc {\n  padding:22px;\n  border-radius:26px;\n  background:#fff;\n  border:1px solid #dbeafe;\n  box-shadow:0 18px 46px rgba(15,23,42,.07);\n}\n\n.toc-title {\n  font-weight:800;\n  margin-bottom:14px;\n  color:#0f172a;\n}\n\n.toc-grid {\n  display:grid;\n  grid-template-columns:repeat(4,1fr);\n  gap:12px;\n}\n\n.toc a {\n  display:block;\n  padding:12px 14px;\n  border-radius:16px;\n  background:#f8fafc;\n  border:1px solid #e2e8f0;\n  color:#166534;\n  font-weight:800;\n  font-size:13px;\n  transition:.2s ease;\n}\n\n.toc a:hover {\n  background:#f0fdf4;\n  border-color:rgba(52,199,89,.45);\n  transform:translateY(-2px);\n}\n\n\/* General layouts *\/\n\n.section-head {\n  display:flex;\n  align-items:flex-end;\n  justify-content:space-between;\n  gap:28px;\n  margin-bottom:42px;\n}\n\n.section-head .lead {\n  margin:0;\n  max-width:620px;\n}\n\n.grid-2 {\n  display:grid;\n  grid-template-columns:repeat(2,1fr);\n  gap:24px;\n}\n\n.grid-3 {\n  display:grid;\n  grid-template-columns:repeat(3,1fr);\n  gap:22px;\n}\n\n.grid-4 {\n  display:grid;\n  grid-template-columns:repeat(4,1fr);\n  gap:18px;\n}\n\n.card {\n  background:#fff;\n  border:1px solid #e2e8f0;\n  border-radius:24px;\n  padding:26px;\n  box-shadow:0 14px 34px rgba(15,23,42,.06);\n}\n\n.card:hover {\n  border-color:rgba(52,199,89,.45);\n  transform:translateY(-2px);\n  transition:.2s ease;\n}\n\n.card p {\n  margin-top:12px;\n}\n\n.icon {\n  width:46px;\n  height:46px;\n  border-radius:16px;\n  display:grid;\n  place-items:center;\n  background:#dcfce7;\n  color:#14532d;\n  font-weight:900;\n  margin-bottom:18px;\n  font-family:'Lexend';\n}\n\n\/* Product cards *\/\n\n.product-card {\n  padding:0;\n  overflow:hidden;\n}\n\n.product-card .image-frame {\n  height:210px;\n  border:0;\n  border-radius:0;\n  border-bottom:1px solid #e2e8f0;\n}\n\n.product-body {\n  padding:24px;\n}\n\n.chips {\n  display:flex;\n  flex-wrap:wrap;\n  gap:8px;\n  margin:16px 0 0;\n}\n\n.chips span {\n  padding:7px 10px;\n  border-radius:999px;\n  background:#f0fdf4;\n  color:#166534;\n  font-size:12px;\n  font-weight:800;\n}\n\n.text-list {\n  display:grid;\n  gap:12px;\n  margin-top:22px;\n}\n\n.text-list div {\n  padding:14px 16px;\n  border-radius:18px;\n  background:#f8fafc;\n  border:1px solid #e2e8f0;\n  color:#0f172a;\n  font-weight:800;\n  line-height:1.5;\n}\n\n.section.dark .text-list div {\n  background:rgba(255,255,255,.08);\n  border-color:rgba(255,255,255,.18);\n  color:#f8fafc;\n}\n\n.section.dark .card,\n.section.dark .visual-card,\n.section.dark .form-card {\n  background:#fff;\n  color:#0f172a;\n}\n\n.section.dark .card h3,\n.section.dark .visual-card h3,\n.section.dark .form-card label,\n.section.dark .product-body h3 {\n  color:#0f172a!important;\n}\n\n.section.dark .card p,\n.section.dark .visual-card p,\n.section.dark .form-card input,\n.section.dark .form-card textarea,\n.section.dark .form-card select,\n.section.dark .product-body p {\n  color:#475569!important;\n}\n\n\/* Build process *\/\n\n.process {\n  counter-reset:step;\n  display:grid;\n  grid-template-columns:repeat(3,1fr);\n  gap:18px;\n}\n\n.step {\n  position:relative;\n  padding:24px;\n  border-radius:24px;\n  background:#fff;\n  border:1px solid #e2e8f0;\n  box-shadow:0 14px 34px rgba(15,23,42,.06);\n}\n\n.step:before {\n  counter-increment:step;\n  content:'0' counter(step);\n  display:inline-flex;\n  align-items:center;\n  justify-content:center;\n  width:42px;\n  height:42px;\n  border-radius:14px;\n  background:#0f172a;\n  color:#fff;\n  font-family:'Lexend';\n  font-weight:800;\n  margin-bottom:18px;\n}\n\n.step h3 {\n  margin-bottom:10px;\n}\n\n\/* Wide feature *\/\n\n.wide-feature {\n  display:grid;\n  grid-template-columns:1fr 1fr;\n  gap:26px;\n  align-items:center;\n}\n\n.wide-feature .image-frame {\n  height:430px;\n}\n\n\/* Table *\/\n\n.table-wrap {\n  background:#fff;\n  border:1px solid #e2e8f0;\n  border-radius:24px;\n  overflow:hidden;\n  box-shadow:0 14px 34px rgba(15,23,42,.06);\n}\n\ntable {\n  width:100%;\n  border-collapse:collapse;\n  table-layout:fixed;\n}\n\nth,\ntd {\n  padding:18px 20px;\n  border-bottom:1px solid #e2e8f0;\n  text-align:left;\n  vertical-align:top;\n  overflow-wrap:anywhere;\n  line-height:1.55;\n}\n\nth {\n  background:#f8fafc;\n  color:#0f172a;\n  font-family:'Lexend';\n  font-size:14px;\n}\n\ntd {\n  color:#475569;\n  font-size:15px;\n}\n\ntr:last-child td {\n  border-bottom:0;\n}\n\n\/* Visual cards *\/\n\n.visual-card .image-frame {\n  height:240px;\n  border:0;\n  border-radius:0;\n  border-bottom:1px solid #e2e8f0;\n}\n\n.visual-body {\n  padding:24px;\n}\n\n.visual-body p {\n  margin-top:10px;\n}\n\n\/* RFQ form *\/\n\n.quote-panel {\n  display:grid;\n  grid-template-columns:.9fr 1.1fr;\n  gap:30px;\n  align-items:start;\n}\n\n.form-card {\n  padding:28px;\n}\n\n.form-grid {\n  display:grid;\n  grid-template-columns:repeat(2,1fr);\n  gap:16px;\n}\n\nlabel {\n  font-weight:800;\n  color:#0f172a;\n  font-size:14px;\n  display:block;\n  margin-bottom:8px;\n}\n\ninput,\ntextarea,\nselect {\n  width:100%;\n  border:1px solid #cbd5e1;\n  border-radius:16px;\n  padding:14px;\n  font:500 15px\/1.4 'Inter';\n  background:#fff;\n  color:#0f172a!important;\n  outline:none;\n}\n\ninput:focus,\ntextarea:focus,\nselect:focus {\n  border-color:#34C759;\n  box-shadow:0 0 0 4px rgba(52,199,89,.12);\n}\n\ntextarea {\n  min-height:126px;\n  resize:vertical;\n}\n\n.full {\n  grid-column:1\/-1;\n}\n\n.submit {\n  width:100%;\n  margin-top:18px;\n  border:0;\n  cursor:pointer;\n}\n\n\/* FAQ *\/\n\n.faq {\n  display:grid;\n  gap:14px;\n}\n\ndetails {\n  background:#fff;\n  border:1px solid #e2e8f0;\n  border-radius:18px;\n  padding:18px 20px;\n}\n\nsummary {\n  cursor:pointer;\n  font-weight:900;\n  color:#0f172a;\n  font-family:'Lexend';\n}\n\ndetails p {\n  margin-top:12px;\n}\n\n\/* Final CTA *\/\n\n.final-cta {\n  padding:84px 20px;\n  background:\n    radial-gradient(\n      circle at top left,\n      rgba(52,199,89,.22),\n      transparent 36%\n    ),\n    linear-gradient(\n      135deg,\n      #07131f,\n      #042114 65%,\n      #020617\n    );\n  color:#fff;\n}\n\n.final-grid {\n  display:grid;\n  grid-template-columns:1fr .78fr;\n  gap:42px;\n  align-items:center;\n}\n\n.final-cta h2 {\n  color:#f8fafc!important;\n}\n\n.final-cta p {\n  color:#d1fae5!important;\n}\n\n.final-card {\n  background:#fff;\n  border-radius:30px;\n  overflow:hidden;\n  box-shadow:var(--shadow);\n}\n\n.final-card .image-frame {\n  height:260px;\n  border:0;\n  border-radius:0;\n  border-bottom:1px solid #e2e8f0;\n}\n\n.final-card-body {\n  padding:26px;\n}\n\n.final-card-body h3 {\n  color:#0f172a!important;\n}\n\n.final-card-body p {\n  color:#475569!important;\n  margin-top:10px;\n}\n\n\n\/* <a href=\"\/about\/\" style=\"font-weight:bold;color:var(--e-global-color-primary,#0058e6);text-decoration:underline;\">YC PCB<\/a> Zeroy contact popup *\/\n\n.ycpcbs-contact-float {\n  position:fixed;\n  right:22px;\n  bottom:22px;\n  z-index:9990;\n  display:inline-flex;\n  align-items:center;\n  justify-content:center;\n  min-height:52px;\n  padding:0 20px;\n  border-radius:999px;\n  background:#34C759;\n  color:#052e16!important;\n  font-family:'Lexend',sans-serif;\n  font-size:14px;\n  font-weight:800;\n  box-shadow:0 16px 36px rgba(15,23,42,.24);\n  transition:transform .2s ease, box-shadow .2s ease;\n}\n\n.ycpcbs-contact-float:hover {\n  transform:translateY(-2px);\n  box-shadow:0 20px 42px rgba(15,23,42,.28);\n}\n\n.ycpcbs-contact-popup {\n  position:fixed;\n  inset:0;\n  z-index:10000;\n  display:none;\n  align-items:center;\n  justify-content:center;\n  padding:24px;\n}\n\n.ycpcbs-contact-popup:target {\n  display:flex;\n}\n\n.ycpcbs-popup-backdrop {\n  position:absolute;\n  inset:0;\n  background:rgba(2,6,23,.72);\n  backdrop-filter:blur(8px);\n}\n\n.ycpcbs-popup-dialog {\n  position:relative;\n  z-index:1;\n  width:min(620px,100%);\n  max-height:calc(100vh - 48px);\n  overflow-y:auto;\n  background:#fff;\n  border:1px solid #dbe5ee;\n  border-radius:28px;\n  box-shadow:0 30px 90px rgba(2,6,23,.34);\n  padding:32px;\n}\n\n.ycpcbs-popup-close {\n  position:absolute;\n  top:16px;\n  right:16px;\n  width:40px;\n  height:40px;\n  display:grid;\n  place-items:center;\n  border-radius:50%;\n  background:#f1f5f9;\n  color:#0f172a!important;\n  font-size:26px;\n  line-height:1;\n  font-weight:700;\n}\n\n.ycpcbs-popup-close:hover {\n  background:#e2e8f0;\n}\n\n.ycpcbs-popup-eyebrow {\n  display:inline-flex;\n  align-items:center;\n  gap:8px;\n  margin-bottom:14px;\n  padding:7px 11px;\n  border-radius:999px;\n  background:#eaf9ee;\n  color:#137333;\n  font-family:'Lexend',sans-serif;\n  font-size:12px;\n  font-weight:800;\n}\n\n.ycpcbs-popup-dialog h2 {\n  margin:0;\n  padding-right:46px;\n  font-size:clamp(26px,4vw,36px);\n  color:#0f172a!important;\n}\n\n.ycpcbs-popup-intro {\n  margin-top:12px;\n  color:#475569!important;\n  font-size:15px;\n  line-height:1.7;\n}\n\n.ycpcbs-popup-form {\n  display:grid;\n  gap:16px;\n  margin-top:24px;\n}\n\n.ycpcbs-popup-form label {\n  display:block;\n  margin-bottom:7px;\n  color:#0f172a!important;\n  font-size:14px;\n  font-weight:800;\n}\n\n.ycpcbs-popup-form input,\n.ycpcbs-popup-form textarea {\n  width:100%!important;\n  border:1px solid #cbd5e1!important;\n  background:#fff!important;\n  color:#0f172a!important;\n  border-radius:14px!important;\n  padding:13px 14px!important;\n  font:500 15px\/1.45 'Inter',sans-serif!important;\n  outline:none!important;\n  box-shadow:none!important;\n  box-sizing:border-box!important;\n}\n\n.ycpcbs-popup-form textarea {\n  min-height:150px!important;\n  resize:vertical!important;\n}\n\n.ycpcbs-popup-form input:focus,\n.ycpcbs-popup-form textarea:focus {\n  border-color:#34C759!important;\n  box-shadow:0 0 0 4px rgba(52,199,89,.13)!important;\n}\n\n.ycpcbs-popup-submit {\n  width:100%;\n  min-height:54px;\n  border:0;\n  border-radius:999px;\n  background:#34C759;\n  color:#052e16;\n  font-family:'Lexend',sans-serif;\n  font-size:15px;\n  font-weight:800;\n  cursor:pointer;\n  transition:.2s ease;\n}\n\n.ycpcbs-popup-submit:hover {\n  background:#2eb94f;\n  transform:translateY(-1px);\n}\n\n.ycpcbs-popup-submit:disabled {\n  cursor:not-allowed;\n  opacity:.65;\n  transform:none;\n}\n\n.ycpcbs-form-status {\n  min-height:22px;\n  color:#475569!important;\n  font-size:14px;\n  line-height:1.5;\n}\n\n.ycpcbs-form-status.is-error {\n  color:#b91c1c!important;\n}\n\n.ycpcbs-inline-contact {\n  display:flex;\n  flex-direction:column;\n  justify-content:center;\n  min-height:100%;\n}\n\n.ycpcbs-inline-contact p {\n  margin-top:12px;\n}\n\n.ycpcbs-inline-contact .btn {\n  margin-top:22px;\n  width:100%;\n}\n\n@media(max-width:640px) {\n  .ycpcbs-contact-float {\n    right:14px;\n    bottom:14px;\n    min-height:48px;\n    padding:0 16px;\n  }\n\n  .ycpcbs-contact-popup {\n    padding:12px;\n    align-items:flex-end;\n  }\n\n  .ycpcbs-popup-dialog {\n    width:100%;\n    max-height:92vh;\n    border-radius:24px 24px 0 0;\n    padding:26px 18px 22px;\n  }\n}\n\n\/* Responsive *\/\n\n@media(max-width:980px) {\n  .hero-grid,\n  .wide-feature,\n  .quote-panel,\n  .final-grid {\n    grid-template-columns:1fr;\n  }\n\n  .grid-3,\n  .process {\n    grid-template-columns:repeat(2,1fr);\n  }\n\n  .grid-4,\n  .stats,\n  .toc-grid {\n    grid-template-columns:repeat(2,1fr);\n  }\n\n  .section-head {\n    display:block;\n  }\n\n  .section-head .lead {\n    margin-top:16px;\n  }\n}\n\n@media(max-width:640px) {\n  .section,\n  .hero {\n    padding:64px 16px;\n  }\n\n  h1 {\n    font-size:38px;\n  }\n\n  h2 {\n    font-size:30px;\n  }\n\n  h3 {\n    font-size:20px;\n  }\n\n  .grid-2,\n  .grid-3,\n  .grid-4,\n  .process,\n  .stats,\n  .hero-caption,\n  .form-grid,\n  .toc-grid {\n    grid-template-columns:1fr;\n  }\n\n  .hero-card .image-frame,\n  .wide-feature .image-frame {\n    height:280px;\n  }\n\n  .product-card .image-frame,\n  .visual-card .image-frame {\n    height:220px;\n  }\n\n  th,\n  td {\n    padding:14px 12px;\n    font-size:14px;\n  }\n\n  .table-wrap {\n    overflow-x:auto;\n  }\n\n  table {\n    min-width:760px;\n  }\n\n  .btn {\n    width:100%;\n  }\n}\n<\/style>\n<main class=\"yc-server\">\n<!-- Hero -->\n<section class=\"hero\">\n<div class=\"container hero-grid\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n          Server &amp; Data Center PCB Manufacturing\n        <\/div>\n<h1>Server and Data Center PCB Manufacturing Solutions<\/h1>\n<p>\n          Source high-layer-count server PCBs and assembled boards from one manufacturing partner. YC PCB supports server motherboards, storage backplanes, network equipment, AI accelerator boards and power boards with stack-up, <a href=\"\/impedance-control-pcb-30-layer-with-8oz-copper\/\" style=\"font-weight:bold;color:var(--e-global-color-primary,#0058e6);text-decoration:underline;\">impedance<\/a>, low-loss material, back-drilling, HDI, thermal and PCBA process support.\n        <\/p>\n<div class=\"hero-kws\">\n<span>server pcb<\/span>\n<span>high speed server pcb<\/span>\n<span>data center pcba<\/span>\n<\/div>\n<div class=\"actions\">\n<a class=\"btn primary\" href=\"#ycpcbs-contact-popup\">\n            Request Engineering Review\n          <\/a>\n<a class=\"btn secondary\" href=\"#server-routes\">\n            View PCB &amp; PCBA Solutions\n          <\/a>\n<\/div>\n<\/div>\n<style>\n  .hero-card {\n    width: 100%;\n    overflow: hidden;\n    border-radius: 16px;\n  }\n\n  .hero-card .image-frame {\n    position: relative;\n    width: 100%;\n    height: 560px;\n    overflow: hidden;\n    background: #f3f4f6;\n  }\n\n  .hero-card .image-frame img {\n    width: 100%;\n    height: 100%;\n    display: block;\n    object-fit: cover;\n    object-position: center;\n    transform: scale(1.15);\n    transition: transform 0.5s ease;\n  }\n\n  .hero-card:hover .image-frame img {\n    transform: scale(1.22);\n  }\n\n  .hero-card .hero-caption {\n    padding: 0;\n    margin: 0;\n  }\n\n  @media (max-width: 1024px) {\n    .hero-card .image-frame {\n      height: 460px;\n    }\n  }\n\n  @media (max-width: 768px) {\n    .hero-card .image-frame {\n      height: 340px;\n    }\n\n    .hero-card .image-frame img {\n      transform: scale(1.08);\n    }\n\n    .hero-card:hover .image-frame img {\n      transform: scale(1.12);\n    }\n  }\n\n  @media (max-width: 480px) {\n    .hero-card .image-frame {\n      height: 280px;\n    }\n  }\n<\/style>\n\n<div class=\"hero-card\">\n  <div class=\"image-frame\">\n    <img\n      src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/15Immersion-Gold-PCB-32-Layer-PCB-scaled.webp\"\n      alt=\"server PCB and data center circuit board for high speed computing hardware\"\n      decoding=\"async\"\n      loading=\"eager\"\n      onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\"\n    \/>\n  <\/div>\n\n  <div class=\"hero-caption\"><\/div>\n<\/div>\n<\/div>\n<\/section>\n<!-- Guide and stats -->\n<section class=\"section tight green-soft\">\n<div class=\"container\">\n<div class=\"toc\">\n<div class=\"toc-title\">\n          Explore Our Server PCB Capabilities\n        <\/div>\n<div class=\"toc-grid\">\n<a href=\"#server-challenge\">Performance Requirements<\/a>\n<a href=\"#server-routes\">PCB &amp; PCBA Solutions<\/a>\n<a href=\"#server-technical\">Engineering Support<\/a>\n<a href=\"#server-rfq\">Quote Requirements<\/a>\n<\/div>\n<\/div>\n<div class=\"stats\">\n<div class=\"stat\">\n<div class=\"stat-num\">40L<\/div>\n<p>\n            Multilayer capability for complex server and networking projects\n          <\/p>\n<\/div>\n<div class=\"stat\">\n<div class=\"stat-num\">HDI<\/div>\n<p>\n            Blind vias, buried vias and dense BGA routing after file review\n          <\/p>\n<\/div>\n<div class=\"stat\">\n<div class=\"stat-num\">PCBA<\/div>\n<p>\n            SMT, BGA, X-Ray, ICT and FCT from bare board to assembly\n          <\/p>\n<\/div>\n<div class=\"stat\">\n<div class=\"stat-num\">DFM<\/div>\n<p>\n            Manufacturability review before production to reduce prototype risk\n          <\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<!-- Challenge -->\n<section class=\"section\" id=\"server-challenge\">\n<div class=\"container wide-feature\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n          Built for High-Speed, High-Load Systems\n        <\/div>\n<h2>Reliable Server Hardware Starts with the Right PCB<\/h2>\n<p class=\"lead\">\n          Server and data center hardware places demanding requirements on signal integrity, power delivery, thermal management and board flatness. YC PCB coordinates material, stack-up, impedance, via structure and assembly details so your boards are prepared for continuous operation and repeat production.\n        <\/p>\n<div class=\"text-list\">\n<div>\n            Protect high-speed interfaces with controlled stack-ups, suitable low-loss materials and continuous return paths.\n          <\/div>\n<div>\n            Support CPUs, GPUs, memory and switching devices with stable power planes, current paths and balanced copper.\n          <\/div>\n<div>\n            Use BGA escape routing, back-drilling, HDI and X-Ray inspection where board density and package structure require them.\n          <\/div>\n<\/div>\n<\/div>\n<div class=\"visual-card\">\n<div class=\"image-frame\">\n<img alt=\"data center circuit board used in server rack computing and network equipment\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/13Impedance-Control-8oz-Copper-30-Layer-PCB-scaled.webp\"\/>\n<\/div>\n<div class=\"visual-body\">\n<h3>Protect Signal Margin and Assembly Yield<\/h3>\n<p>\n            Early confirmation of stack-up, via stubs, copper balance, thermal paths and BGA assembly details helps reduce redesigns, warpage, soldering defects and delayed validation.\n          <\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<!-- PCB routes -->\n<section class=\"section light\" id=\"server-routes\">\n<div class=\"container\">\n<div class=\"section-head\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n            PCB &amp; PCBA Capabilities\n          <\/div>\n<h2>Solutions for Server, Storage, Network and AI Hardware<\/h2>\n<\/div>\n<p class=\"lead\">\n          Send your design files, quantity and delivery target. Our engineering team will recommend a practical manufacturing route based on layer count, interface speed, BGA density, copper weight, material requirements, connector design and test scope.\n        <\/p>\n<\/div>\n<div class=\"grid-3\">\n<article class=\"card product-card\">\n<div class=\"image-frame\">\n<img alt=\"server motherboard PCB with high density BGA routing and power areas\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/11High-Density-Multilayer-rigid-PCB-scaled.webp\"\/>\n<\/div>\n<div class=\"product-body\">\n<h3>Server Motherboard PCB<\/h3>\n<p>\n              High-layer-count motherboards for CPU, memory and VRM sections, with controlled stack-up, dense BGA routing and balanced copper.\n            <\/p>\n<div class=\"chips\">\n<span>High Layer Count<\/span>\n<span>BGA<\/span>\n<span>PDN<\/span>\n<\/div>\n<\/div>\n<\/article>\n<article class=\"card product-card\">\n<div class=\"image-frame\">\n<img alt=\"high speed server PCB for PCIe SerDes and network signal channels\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/6ENIG-8-Layer-PCB-scaled.webp\"\/>\n<\/div>\n<div class=\"product-body\">\n<h3>High-Speed Network Board<\/h3>\n<p>\n              Controlled-impedance boards for switches, routers and optical network equipment, with low-loss material and signal-path support when required.\n            <\/p>\n<div class=\"chips\">\n<span>SerDes<\/span>\n<span>Impedance<\/span>\n<span>Low-Loss<\/span>\n<\/div>\n<\/div>\n<\/article>\n<article class=\"card product-card\">\n<div class=\"image-frame\">\n<img alt=\"data center storage backplane PCB with multilayer stack up and connector routing\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/10Gold-Finger-16-Layer-PCB-scaled.webp\"\/>\n<\/div>\n<div class=\"product-body\">\n<h3>Storage Backplane PCB<\/h3>\n<p>\n              Connector-dense backplanes for PCIe, NVMe and storage expansion, with back-drilling, mechanical fit and lane consistency support.\n            <\/p>\n<div class=\"chips\">\n<span>PCIe<\/span>\n<span>Back-Drilling<\/span>\n<span>Connectors<\/span>\n<\/div>\n<\/div>\n<\/article>\n<article class=\"card product-card\">\n<div class=\"image-frame\">\n<img alt=\"server power distribution PCB with thermal vias and heavy copper review\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/9Impedance-Control-8oz-Copper-scaled.webp\"\/>\n<\/div>\n<div class=\"product-body\">\n<h3>Power Distribution Board<\/h3>\n<p>\n              Heavy-copper and power boards designed around current paths, thermal vias, copper thickness and heat-spreading requirements.\n            <\/p>\n<div class=\"chips\">\n<span>Heavy Copper<\/span>\n<span>Thermal<\/span>\n<span>VRM<\/span>\n<\/div>\n<\/div>\n<\/article>\n<article class=\"card product-card\">\n<div class=\"image-frame\">\n<img alt=\"AI accelerator PCB and computing PCB solution for data center hardware\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/2HDI-PCB-FR4-20-Layer-PCB-scaled.webp\"\/>\n<\/div>\n<div class=\"product-body\">\n<h3>AI Accelerator PCB<\/h3>\n<p>\n              HDI and multilayer boards for accelerator and GPU-related hardware, supporting dense routing, high current and thermal management requirements.\n            <\/p>\n<div class=\"chips\">\n<span>AI Computing<\/span>\n<span>HDI<\/span>\n<span>Thermal Load<\/span>\n<\/div>\n<\/div>\n<\/article>\n<article class=\"card product-card\">\n<div class=\"image-frame\">\n<img alt=\"data center PCBA with BGA assembly AOI X-Ray ICT and FCT testing\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/6PCB-with-Gold-Fingers-and-SMT-Components-scaled.webp\"\/>\n<\/div>\n<div class=\"product-body\">\n<h3>Data Center PCBA<\/h3>\n<p>\n              Turnkey assembly for server and network boards, including component sourcing, SMT\/BGA placement, X-Ray, ICT, FCT and project-specific packing.\n            <\/p>\n<div class=\"chips\">\n<span>SMT<\/span>\n<span>X-Ray<\/span>\n<span>FCT<\/span>\n<\/div>\n<\/div>\n<\/article>\n<\/div>\n<\/div>\n<\/section>\n<!-- Engineering priorities -->\n<section class=\"section dark\" id=\"server-technical\">\n<div class=\"container\">\n<div class=\"section-head\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n            Engineering Review Before Production\n          <\/div>\n<h2>Key Items We Confirm for High-Speed Server PCB Orders<\/h2>\n<\/div>\n<p class=\"lead\">\n          Before production, our engineers confirm the details that influence performance, manufacturability and repeatability. This gives your purchasing and engineering teams a clearer build route before material and tooling are committed.\n        <\/p>\n<\/div>\n<div class=\"grid-3\">\n<div class=\"card\">\n<div class=\"icon\">1<\/div>\n<h3>Material Selection<\/h3>\n<p>\n            We match standard FR4 or low-loss material options to your interface speed, channel length, Dk\/Df target, operating environment and budget.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<div class=\"icon\">2<\/div>\n<h3>Stack-Up &amp; Reference Planes<\/h3>\n<p>\n            We review layer order, dielectric thickness, reference planes, ground continuity and stack-up symmetry to support controlled routing and reduce warpage risk.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<div class=\"icon\">3<\/div>\n<h3>Differential Impedance<\/h3>\n<p>\n            Provide single-ended and differential impedance values, tolerances and critical net groups. We confirm manufacturable trace geometry, coupon design and TDR reporting needs.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<div class=\"icon\">4<\/div>\n<h3>Via Structure &amp; Back-Drilling<\/h3>\n<p>\n            Back-drilling, blind or buried vias, via-in-pad and HDI structures are evaluated where dense BGA fanout or high-speed channels require them.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<div class=\"icon\">5<\/div>\n<h3>Power Delivery &amp; Copper Balance<\/h3>\n<p>\n            We check copper weight, power planes, current paths, decoupling areas and copper distribution for stable power delivery and repeatable fabrication.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<div class=\"icon\">6<\/div>\n<h3>BGA &amp; QFN Assembly<\/h3>\n<p>\n            Pad design, solder mask openings, stencil, reflow profile and X-Ray requirements are confirmed to improve BGA and QFN assembly yield.\n          <\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<!-- Stack-up table -->\n<section class=\"section\">\n<div class=\"container\">\n<div class=\"section-head\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n            Material &amp; Build Specification\n          <\/div>\n<h2>Select the Right Stack-Up and Material for Your Project<\/h2>\n<\/div>\n<p class=\"lead\">\n          Share the following information with your RFQ so we can recommend the right material and build route without adding unnecessary cost. Final specifications are confirmed after your speed target, drilling plan, BGA layout and assembly scope are reviewed.\n        <\/p>\n<\/div>\n<div class=\"table-wrap\">\n<table>\n<thead>\n<tr>\n<th>Design Area<\/th>\n<th>What Your Project Needs<\/th>\n<th>YC PCB Manufacturing Support<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Layer Count<\/td>\n<td>\n                Enough signal, power and ground layers to support memory, storage, network, control and power-delivery functions.\n              <\/td>\n<td>\n                Layer-count feasibility, lamination sequence, copper balance, drill structure and production panel planning.\n              <\/td>\n<\/tr>\n<tr>\n<td>Low-Loss Material<\/td>\n<td>\n                Suitable dielectric performance for long differential pairs, SerDes links and other loss-sensitive channels.\n              <\/td>\n<td>\n                Material family, Dk\/Df target, signal-layer position, channel length and cost-effective alternatives.\n              <\/td>\n<\/tr>\n<tr>\n<td>Impedance Control<\/td>\n<td>\n                Predictable trace geometry and reference planes for PCIe, SerDes, Ethernet, memory and other controlled-impedance nets.\n              <\/td>\n<td>\n                Impedance values, trace geometry, dielectric thickness, test coupons and TDR report requirements.\n              <\/td>\n<\/tr>\n<tr>\n<td>Back-Drilling \/ HDI<\/td>\n<td>\n                A via structure that supports dense BGA breakout while limiting unwanted stubs on critical signal paths.\n              <\/td>\n<td>\n                Back-drill depth, residual-stub target, blind\/buried vias, via-in-pad filling and plating process.\n              <\/td>\n<\/tr>\n<tr>\n<td>PDN and Heavy Copper<\/td>\n<td>\n                Low-resistance current paths and effective heat spreading around VRM, processor and power-module areas.\n              <\/td>\n<td>\n                Copper weight, plane geometry, thermal-via areas, heat-source locations and current-path requirements.\n              <\/td>\n<\/tr>\n<tr>\n<td>Data Center PCBA<\/td>\n<td>\n                A controlled assembly and test route for dense BGAs, high-pin-count connectors and functional interfaces.\n              <\/td>\n<td>\n                BOM, pick-and-place data, package details, X-Ray scope, ICT\/FCT fixtures and ESD packing requirements.\n              <\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<\/section>\n<!-- Build path -->\n<section class=\"section light\">\n<div class=\"container\">\n<div class=\"section-head\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n            Order &amp; Production Process\n          <\/div>\n<h2>A Clear Route from Engineering Review to Tested PCBA<\/h2>\n<\/div>\n<p class=\"lead\">\n          One team coordinates PCB fabrication, component sourcing, assembly, inspection and packing, reducing supplier handoffs and making prototype-to-batch production easier to manage.\n        <\/p>\n<\/div>\n<div class=\"process\">\n<div class=\"step\">\n<h3>File &amp; Requirement Review<\/h3>\n<p>\n            We check Gerber or ODB++, drill files, stack-up, impedance requirements, mechanical drawings, quantities and target delivery dates.\n          <\/p>\n<\/div>\n<div class=\"step\">\n<h3>DFM &amp; Stack-Up Confirmation<\/h3>\n<p>\n            Our engineers confirm layer order, dielectric thickness, reference planes, copper balance, via structure and any back-drilling requirements.\n          <\/p>\n<\/div>\n<div class=\"step\">\n<h3>PCB Fabrication<\/h3>\n<p>\n            Boards are manufactured using the confirmed material, lamination, drilling, plating, solder mask and surface-finish process.\n          <\/p>\n<\/div>\n<div class=\"step\">\n<h3>Electrical &amp; Impedance Testing<\/h3>\n<p>\n            Electrical testing and impedance-coupon verification are completed according to the agreed inspection and documentation requirements.\n          <\/p>\n<\/div>\n<div class=\"step\">\n<h3>SMT \/ BGA Assembly<\/h3>\n<p>\n            SMT, BGA\/QFN reflow, connector soldering and X-Ray inspection are carried out according to the approved assembly route.\n          <\/p>\n<\/div>\n<div class=\"step\">\n<h3>Functional Test &amp; Packing<\/h3>\n<p>\n            ICT\/FCT fixtures, firmware steps, ESD protection, board support, labels and delivery documents are completed as specified.\n          <\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<!-- Hidden risks -->\n<section class=\"section dark\">\n<div class=\"container\">\n<div class=\"section-head\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n            Risk Control\n          <\/div>\n<h2>Critical Checks That Protect Your Server PCB Order<\/h2>\n<\/div>\n<p class=\"lead\">\n          These checks help reduce signal loss, soldering defects, warpage, hot spots and test delays before your boards reach system validation.\n        <\/p>\n<\/div>\n<div class=\"grid-4\">\n<article class=\"visual-card\">\n<div class=\"image-frame\">\n<img alt=\"controlled impedance test coupon and high speed differential pair review\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/9Impedance-Control-8oz-Copper-1-scaled.webp\"\/>\n<\/div>\n<div class=\"visual-body\">\n<h3>Impedance Coupon<\/h3>\n<p>\n              Critical channels, coupon design and TDR reporting requirements are confirmed before fabrication begins.\n            <\/p>\n<\/div>\n<\/article>\n<article class=\"visual-card\">\n<div class=\"image-frame\">\n<img alt=\"X-Ray inspection for BGA packages on data center PCBA\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/X-%E5%B0%84%E7%BA%BF%E6%A3%80%E6%B5%8B.jpg\"\/>\n<\/div>\n<div class=\"visual-body\">\n<h3>BGA X-Ray<\/h3>\n<p>\n              X-Ray inspection verifies hidden solder joints beneath BGA and QFN packages that cannot be checked visually.\n            <\/p>\n<\/div>\n<\/article>\n<article class=\"visual-card\">\n<div class=\"image-frame\">\n<img alt=\"thermal via and heavy copper review for high power server boards\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/435um-Copper-printed-circuit-board-scaled.webp\"\/>\n<\/div>\n<div class=\"visual-body\">\n<h3>Thermal Path<\/h3>\n<p>\n              Heat-source locations, copper planes, thermal vias and contact areas are coordinated to improve heat spreading.\n            <\/p>\n<\/div>\n<\/article>\n<article class=\"visual-card\">\n<div class=\"image-frame\">\n<img alt=\"high layer count server PCB copper balance and warpage review\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/12Custom-PCB-Boards-with-20-Layer-PCB-scaled.webp\"\/>\n<\/div>\n<div class=\"visual-body\">\n<h3>Copper Balance<\/h3>\n<p>\n              Balanced copper distribution and a suitable lamination route help reduce warpage in high-layer-count boards.\n            <\/p>\n<\/div>\n<\/article>\n<\/div>\n<\/div>\n<\/section>\n Application Coverage \n<section class=\"section\">\n<div class=\"container\">\n<div class=\"section-head\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n            Application Coverage\n          <\/div>\n<h2>PCB and PCBA for Data Center Hardware<\/h2>\n<\/div>\n<p class=\"lead\">\n          YC PCB supports bare-board and assembled solutions for computing, storage, networking, power, management and validation hardware.\n        <\/p>\n<\/div>\n<div class=\"grid-4\">\n<div class=\"card\">\n<h3>Cloud Server Boards<\/h3>\n<p>\n            High-layer-count PCB and PCBA for cloud infrastructure, rack servers and dense computing platforms.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<h3>AI Accelerator Hardware<\/h3>\n<p>\n            HDI and <a href=\"\/multilayer-pcb\/\" style=\"font-weight:bold;color:var(--e-global-color-primary,#0058e6);text-decoration:underline;\">multilayer PCB<\/a> support for accelerator modules, GPU-related boards and high-power computing electronics.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<h3>Storage Backplanes<\/h3>\n<p>\n            Connector-heavy storage, NVMe and expansion boards with mechanical-fit, back-drilling and high-speed lane support.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<h3>Network Equipment<\/h3>\n<p>\n            Controlled-impedance PCB and PCBA for switches, routers, optical networking and communication equipment.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<h3>Edge Computing Systems<\/h3>\n<p>\n            Compact boards manufactured around enclosure space, thermal paths, connector positions and environmental requirements.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<h3>Power and VRM Boards<\/h3>\n<p>\n            Heavy-copper and power-distribution boards matched to current, temperature-rise and heat-spreading requirements.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<h3>Management Modules<\/h3>\n<p>\n            Control, monitoring, interface and BMC-related boards for server and data center equipment.\n          <\/p>\n<\/div>\n<div class=\"card\">\n<h3>Test and Validation Boards<\/h3>\n<p>\n            Fixture boards, interface boards and validation PCBA for engineering tests and production verification.\n          <\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<!-- RFQ -->\n<section class=\"section dark\" id=\"server-rfq\">\n<div class=\"container quote-panel\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n          Request a Manufacturing Review\n        <\/div>\n<h2>Send Your Files for a Server PCB or PCBA Quote<\/h2>\n<p class=\"lead\">\n          Share your design package, target quantity and delivery requirement. We will confirm the manufacturing route, raise any technical questions and prepare the quotation.\n        <\/p>\n<div class=\"text-list\">\n<div>\n            Gerber or ODB++, drill files, IPC netlist and mechanical drawing\n          <\/div>\n<div>\n            Layer stack-up, material preference, Dk\/Df target, copper weight and quantity\n          <\/div>\n<div>\n            Impedance table, interface speeds, critical net groups and report requirements\n          <\/div>\n<div>\n            Back-drilling, blind\/buried vias, via-in-pad or HDI requirements\n          <\/div>\n<div>\n            BOM, pick-and-place file, BGA package data, test plan and packing requirements for PCBA\n          <\/div>\n<\/div>\n<\/div>\n<div class=\"form-card ycpcbs-inline-contact\">\n<h3>Start Your Server PCB Project<\/h3>\n<p>Open the project form and send your contact details together with the board type, layer count, quantity, material, impedance, delivery target and PCBA requirements.<\/p>\n<div class=\"chips\">\n<span>Gerber \/ ODB++<\/span>\n<span>Stack-Up<\/span>\n<span>Impedance<\/span>\n<span>PCBA Scope<\/span>\n<\/div>\n<a class=\"btn dark\" href=\"https:\/\/wa.me\/8613827881651\" target=\"_blank\" rel=\"noopener\">Send Project Requirements<\/a>\n<\/div>\n<\/div>\n<\/section>\n<!-- FAQ -->\n<section class=\"section light\">\n<div class=\"container\">\n<div class=\"section-head\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n            FAQ\n          <\/div>\n<h2>Server Data Center PCB FAQ<\/h2>\n<\/div>\n<p class=\"lead\">\n          Answers to common questions from purchasing managers and hardware engineers preparing server PCB, network board and data center PCBA orders.\n        <\/p>\n<\/div>\n<div class=\"faq\">\n<details open=\"\">\n<summary>\n            What makes a server PCB different from a standard multilayer PCB?\n          <\/summary>\n<p>\n            A server PCB usually carries high-speed channels, dense BGA routing,\n            multiple power domains, strict impedance requirements and higher\n            thermal load. Stack-up, material loss, via design and PDN planning\n            must be reviewed together.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            What files should be sent for high speed server PCB review?\n          <\/summary>\n<p>\n            Send Gerber or ODB++ data, drill files, stack-up notes, impedance\n            table, material preference, copper weight, BGA pitch, back-drilling\n            notes, mechanical drawing, BOM and test requirements if assembly\n            is needed.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            Can YC PCB review high-layer-count data center circuit boards?\n          <\/summary>\n<p>\n            YC PCB can review high-layer-count PCB projects according to\n            stack-up, material, drill, impedance, copper balance, BGA routing\n            and testing requirements. The final route is confirmed after file\n            review.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            When should low-loss materials be considered for data center\n            boards?\n          <\/summary>\n<p>\n            Low-loss materials should be considered when the design includes\n            high-speed interfaces, long differential pairs, SerDes channels,\n            high-frequency networking paths or signal margin requirements that\n            cannot be met with standard FR4.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            Why is back-drilling used in high speed server PCB designs?\n          <\/summary>\n<p>\n            Back-drilling helps remove unused via stubs that can create\n            reflections and degrade high-speed signals. It is commonly reviewed\n            for PCIe, SerDes, high-speed network and storage interface designs.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            Can YC PCB support data center PCBA assembly?\n          <\/summary>\n<p>\n            YC PCB can review data center PCBA projects involving SMT, BGA,\n            QFN, component sourcing, AOI, X-Ray, ICT, FCT and project-specific\n            functional testing requirements.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            How should PDN and thermal requirements be described?\n          <\/summary>\n<p>\n            Provide power rails, current areas, VRM position, copper weight,\n            heat source locations, thermal via needs, heat sink contact areas\n            and any system cooling constraints so the design can be reviewed\n            properly.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            Is HDI required for server and AI computing boards?\n          <\/summary>\n<p>\n            HDI may be needed when BGA density, routing escape, connector pitch\n            or board size limits cannot be handled with standard <a href=\"\/pcb-assembly\/\" style=\"font-weight:bold;color:var(--e-global-color-primary,#0058e6);text-decoration:underline;\">through-hole<\/a>\n            multilayer routing. The need should be confirmed through stack-up\n            and layout review.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            How does copper balance affect high-layer-count server boards?\n          <\/summary>\n<p>\n            Uneven copper distribution can increase lamination, plating and\n            reflow warpage risk. High-layer-count server boards should be\n            reviewed for symmetrical structure and balanced copper areas.\n          <\/p>\n<\/details>\n<details>\n<summary>\n            Can YC PCB support network equipment and 5G PCB projects?\n          <\/summary>\n<p>\n            Yes. We can support network and communication PCB projects with high-frequency materials, impedance control, thermal management, assembly and project-specific testing after file review.\n          <\/p>\n<\/details>\n<\/div>\n<\/div>\n<\/section>\n<!-- Final CTA -->\n<section class=\"final-cta\">\n<div class=\"container final-grid\">\n<div>\n<div class=\"eyebrow\">\n<span class=\"dot\"><\/span>\n          Start Your Project\n        <\/div>\n<h2>\n          Get a Manufacturing Route and Quote for Your Server PCB\n        <\/h2>\n<p class=\"lead\">\n          Send your PCB files, stack-up, impedance table, quantity and PCBA requirements. YC PCB will confirm the material, via structure, inspection route and assembly scope needed for prototype or batch production.\n        <\/p>\n<div class=\"actions\">\n<a class=\"btn primary\" href=\"https:\/\/wa.me\/8613827881651\" target=\"_blank\" rel=\"noopener\">\n            Request Engineering Review\n          <\/a>\n<a class=\"btn secondary\" href=\"https:\/\/wa.me\/8613827881651\" target=\"_blank\" rel=\"noopener\">\n            Send Project Requirements\n          <\/a>\n<\/div>\n<\/div>\n<div class=\"final-card\">\n<div class=\"image-frame\">\n<img alt=\"server data center PCB quotation and stack up engineering review\" decoding=\"async\" loading=\"lazy\" onerror=\"this.onerror=null;this.src='https:\/\/ycpcbs.com\/wp-content\/uploads\/2026\/04\/PCB-SMT-1-scaled.webp';\" src=\"https:\/\/ycpcbs.com\/wp-content\/uploads\/2025\/09\/1OEMODM-ENIG-Multilayer-PCB-scaled.webp\"\/>\n<\/div>\n<div class=\"final-card-body\">\n<h3>Reduce Risk Before the First Build<\/h3>\n<p>\n            Early confirmation of stack-up, impedance, via design, copper balance, assembly and test requirements helps prevent avoidable redesigns and production delays.\n          <\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n<\/main>\n\n<a class=\"ycpcbs-contact-float\" href=\"#ycpcbs-contact-popup\" aria-label=\"Open YC PCB contact form\">\ud83d\udcac Contact Us<\/a>\n\n<section class=\"ycpcbs-contact-popup\" id=\"ycpcbs-contact-popup\" aria-labelledby=\"ycpcbs-popup-title\">\n<a class=\"ycpcbs-popup-backdrop\" href=\"#server-rfq\" aria-label=\"Close contact form\"><\/a>\n<div class=\"ycpcbs-popup-dialog\" role=\"dialog\" aria-modal=\"true\">\n<a class=\"ycpcbs-popup-close\" href=\"#server-rfq\" aria-label=\"Close contact form\">\u00d7<\/a>\n<div class=\"ycpcbs-popup-eyebrow\">YC PCB Engineering Review<\/div>\n<h2 id=\"ycpcbs-popup-title\">Send Your Project Requirements<\/h2>\n<p class=\"ycpcbs-popup-intro\">Tell us how to contact you and briefly describe your PCB or PCBA project. You may include the board type, layer count, quantity, material, impedance, delivery target and assembly requirements.<\/p>\n\n<form class=\"ycpcbs-popup-form\" id=\"ycpcbs-contact-form\" data-endpoint=\"https:\/\/ycpcbs.com\/wp-json\/zeroy\/v1\/submissions\">\n<div>\n<label for=\"ycpcbs-name\">Name<\/label>\n<input id=\"ycpcbs-name\" name=\"name\" type=\"text\" placeholder=\"Your name\" autocomplete=\"name\" required\/>\n<\/div>\n\n<div>\n<label for=\"ycpcbs-phone\">Email \/ WhatsApp \/ Phone<\/label>\n<input id=\"ycpcbs-phone\" name=\"phone\" type=\"text\" placeholder=\"Email, WhatsApp or phone number\" autocomplete=\"email\" required\/>\n<\/div>\n\n<div>\n<label for=\"ycpcbs-message\">Project Requirements<\/label>\n<textarea id=\"ycpcbs-message\" name=\"message\" placeholder=\"Example: 20-layer server PCB, 10 prototypes + 500 pcs, controlled impedance, back-drilling and PCBA required.\" required><\/textarea>\n<\/div>\n\n<input name=\"_zeroy_hp\" type=\"text\" value=\"\" tabindex=\"-1\" autocomplete=\"off\" aria-hidden=\"true\" style=\"display:none!important;\"\/>\n<input name=\"_zeroy_redirect\" type=\"hidden\" value=\"https:\/\/ycpcbs.com\/\"\/>\n\n<button class=\"ycpcbs-popup-submit\" type=\"submit\">Send Project Requirements<\/button>\n<p class=\"ycpcbs-form-status\" id=\"ycpcbs-form-status\" aria-live=\"polite\"><\/p>\n<\/form>\n<\/div>\n<\/section>\n\n<script>\ndocument.addEventListener('DOMContentLoaded', function () {\n  const form = document.getElementById('<a href=\"\/about\/\" style=\"font-weight:bold;color:var(--e-global-color-primary,#0058e6);text-decoration:underline;\">ycpcb<\/a>s-contact-form');\n  if (!form) return;\n\n  const status = document.getElementById('ycpcbs-form-status');\n  const submitButton = form.querySelector('[type=\"submit\"]');\n  const defaultButtonText = submitButton ? submitButton.textContent : 'Send Project Requirements';\n\n  form.addEventListener('submit', async function (event) {\n    event.preventDefault();\n\n    if (!form.checkValidity()) {\n      form.reportValidity();\n      return;\n    }\n\n    if (submitButton) {\n      submitButton.disabled = true;\n      submitButton.textContent = 'Sending...';\n    }\n\n    if (status) {\n      status.textContent = '';\n      status.classList.remove('is-error');\n    }\n\n    try {\n      const endpoint = form.dataset.endpoint || 'https:\/\/ycpcbs.com\/wp-json\/zeroy\/v1\/submissions';\n      const response = await fetch(endpoint, {\n        method: 'POST',\n        body: new FormData(form),\n        headers: {\n          'Accept': 'application\/json'\n        }\n      });\n\n      const result = await response.json();\n\n      if (response.ok && result && result.success === true) {\n        if (status) {\n          status.textContent = 'Submitted successfully. 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YC PCB supports server motherboards, storage backplanes, network equipment, AI accelerator boards and power boards with stack-up, impedance, low-loss material, back-drilling, HDI, thermal and PCBA process support. server pcb high speed [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_seopress_titles_title":"Server & Data Center PCB Solutions | High-Speed PCBs \u2013 YC PCB","_seopress_titles_desc":"High-performance server and data center PCBs. High-speed signal integrity design, low-loss materials, heavy copper power planes. 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